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TSMC will establish a semiconductor R&D base in Tsukuba, Japan. The ministry will provide 19 billion yen in subsidies, more than half of the project’s cost of 37 billion yen. The center will focus on semiconductor packaging. About 20 Japanese chipmakers such as Hitachi High-Tech and Asahi Kasei are planning to collaborate with TSMC.
TSMC plans to build a $189M research development center in Ibaraki Prefecture, northeast of Tokyo. The center will focus on advanced semi packaging and testing, and the company could install a local production line to add capacity.
What has changed in semiconductor industry in the last one year? Comparing revenue break of TSMC Q3 20 vs Q3 19 across technology, product and geo. Three major points. 1. Less than 7nm share grew from 27% to 43%. 2. HPC share grew from 29% to 37%. (More cloud?). Also automotive declining. 3. China share grew to 22% from 20%. (Hoarding before sanctions?)
Ansys achieved certification of its multiphysics signoff solution for TSMC‘s most advanced 3nm process technology. This enables mutual customers to satisfy key power, thermal and reliability requirements for the world’s largest AI/ML, 5G, HPC, networking and autonomous vehicle chips.